March 28th, 2019
New space-qualified CMOS image sensor delivers performance and value for harsh environments

CHELMSFORD, UK, March 28, 2019 — Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company, has released a new image sensor package, the CIS120. Samples are available now (since February 2019) along with a full test and demonstration system. This new and anticipated industry-leading image detector is an easy-to-use general-purpose imager designed for harsh environments such as space applications.

 

Key specifications of the CIS120 include a resolution of 2048 x 2048 and back-illuminated 10µm square pixels with a quantum efficiency of 90% at 550 nm (typical) for outstanding low light sensitivity. The sensor offers both a rolling shutter mode with a frame rate of 30 fps (8 bit) and a global shutter mode with a frame rate of 20 fps (12 bit). A combination of low readout noise and on-chip analog-to-digital conversion provides excellent image quality.

 

Key features include:

• Good latch-up immunity and high SEU threshold by design and is resistant to ionising radiation by process choice
• Pixel read timing is set by an on-chip sequencer to simplify use and to reduce pin count
• A column parallel ADC is used to quantize each row of pixels in turn and is controlled by its own sequencer
• Resolution can be set anywhere from 8 to 14 bits
• Four LVDS channels output the image data and are controlled by the readout sequencer to scan along each row in turn. Two LVDS synchronisation channels allow accurate data sampling
• All configuration settings are programmed over an SPI. This includes shutter mode, ADC resolution and bias current values
• Package options include ceramic PGA and metal and ceramic three-side butting designs for use in mosaic focal planes
• CIS120 is stitched, so other sizes are possible from 2048 × 1024, up to 2048 × 8192 pixels, without the cost of new masks as well as other customer-specific requirements such as anti-reflective coatings

 

Further information can be found here:

 

Teledyne e2v is a part of the Teledyne Imaging group. Their innovations lead developments in healthcare, life sciences, space, transportation, defense and security, and industrial markets.

Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and then partnering with them to provide innovative standard, semi-custom or fully-custom imaging solutions, bringing increased value to their systems.

 

Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum with decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.