Asian Surveying & Mapping
Breaking News
Isro to Launch Cartosat 2 Sat with 30 Nano Sats in Mid-December
After the unsuccessful launch of navigation satellite IRNSS-1H, Indian...
Singapore Implements its First Tariff Increase in 17 Years to Secure its Future Water Needs
The Public Utilities Board of Singapore (PUB) implemented this...
A-ASI Announces Collaboration with KAIST’S CR2CENT
SAN DIEGO/SEOUL  – General Atomics Aeronautical Systems, Inc. (GA‑ASI),...
DJI Opens Its First Drone Arena in Japan
DJI, the world leader in civilian drones and aerial...
Russia Launched European Satellite Successfully as Part of ESA’s Copernicus Programme
Russia has recently launched a satellite into the orbit...
ADEX 2017: South Korea Showcases Unmanned Solutions
South Korean defence contractors have put unmanned aircraft systems...
ISRO Eyes to Shrug Off Setback with Cartosat Launch in December
The Indian Space Research Organisation plans to launch a...
Iran to Launch Communications Satellite by 2021
TEHRAN (MNA) – The head of Iranian Space Research...
Australian Geospatial Specialists Sign Tech Agreement
Perth-based geospatial technology developer Pointerra has entered into a...
Call for Papers Open for Locate18/GeoSmart Asia 2018
The premiere geospatial event in Australia is starting to...

June 8th, 2017
NXP Releases the Industry’s Highest Power Density for RF LDMOS in Avionics

HONOLULU – IMS 2017 – NXP Semiconductors N.V. (NASDAQ:NXPI), the leader in RF power, today announced the industry’s most compact RF laterally diffused metal oxide semiconductor (LDMOS) solution for the automatic dependent surveillance-broadcast (ADS-B) and unmanned aerial vehicle (UAV) transponder markets. With more than 700 watts (W) of pulsed power packed in a 50 ohm power amplifier half the size of a credit card, the AFV10700H meets the size, weight, power and cost (SWaP-C) requirements of the aeronautics industry.

The AFV10700H is based on NXP’s leading-edge Airfast technology and is contained in a small NI-780 air cavity package, which occupies 40 percent less space than the standard NI-1230 package used by other LDMOS solutions of similar power level today. Its highly integrated on-chip pre-matching delivers a high output impedance that helps reduce the size of the matching circuitry, enabling a 1.3″ x 2.6″ (3.3 x 6.6 cm) power amplifier. Simultaneously, the industry-leading thermal resistance further reduces the weight of the transponder by enabling smaller heatsink designs.

“This new solution is an excellent example of NXP’s commitment to develop compelling products that address the stringent requirements in size and performance of L-Band pulsed applications,” said Pierre Piel, senior director and general manager for multimarket RF power at NXP. “High performance and ease of use are the key pillars of our design philosophy.”

Designed for pulsed applications such as commercial automatic dependent surveillance — broadcast (ADS-B), UAVs and military identification, friend or foe (IFF), the device outputs 700 W P1dB at 1090 megahertz (MHz) with 50 volts (V) and 56 percent efficiency. If operated at 52 V, it can achieve 850 W P1dB at 1030 MHz with 52 percent efficiency. The low thermal impedance supports high duty factor pulse trains, such as Mode-S Extended Length Message (ELM) and Link 16.

The new offering further densifies NXP’s portfolio of 960-1215 MHz LDMOS transistors for avionics applications, which now comprises 10 different power levels from 10-1300 W. This wide offering provides RF designers with flexibility and options for their transponder designs.

Availability and Showcase

The AFV10700H transistor is in production now and is supported by a reference circuit for 1030-1090 MHz narrowband operations. For more information, visit www.nxp.com/AFV10700H.

NXP is showcasing the new transistor at the International Microwave Symposium, June 6-8, in Honolulu, Booth 1132.

About NXP Semiconductors

NXP Semiconductors N.V. (NASDAQ:NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 31,000 employees in more than 33 countries and posted revenue of $9.5 billion in 2016. Find out more at www.nxp.com.