Queclink Wireless Solutions has launched Queclink Connect, a new connectivity service designed to provide secure, factory-integrated global IoT connectivity across its telematics and IoT device portfolio.
The service is powered by global SecurityTech company Giesecke+Devrient (G+D) with its IoTgo Connect solution. Through this collaboration, Queclink leverages G+D’s secure connectivity management infrastructure, industrial-grade SIM and eSIM technologies, and global multi-IMSI capabilities across Tier-1 operators. The partnership reinforces Queclink’s ability to deliver reliable and scalable connectivity for long-term IoT operations.
With G+D IoTgo Connect, G+D provides the secure connectivity backbone including centralized lifecycle management: from profile provisioning to in-life operations across the entire device lifecycle. This turns hardware and connectivity into an integrated, globally scalable solution for long-term IoT projects.
As fleet, asset, and industrial IoT deployments increasingly span multiple countries and operator networks, connectivity management has become a critical operational factor. Queclink Connect addresses this requirement by integrating global connectivity directly into devices at the manufacturing stage, enabling customers to deploy internationally with reduced logistical complexity.
The solution supports pluggable SIM card (3FF/4FF) and embedded SIM (MFF2/MFF4) formats, with UICC or eUICC features, installed and configured prior to shipment.The service provides global and regional multi-network coverage, pre-activation and validation before delivery, and centralized lifecycle management. By combining hardware and connectivity within a unified workflow, Queclink reduces SIM handling requirements, shortens deployment cycles, and improves operational efficiency for distribution partners and solution providersG+D’s industrial-grade pluggable SIM cards (3FF/4FF) and embedded SIMs (MFF2/MFF4) are engineered for harsh environments and long service life. Pre‑activation and validation prior to shipment shorten time‑to‑value and simplify onboarding for distributors and solution providers.
